The modules package concept has now gained acceptance as it offers compact and easy to handle designs. The semiconductor junctions are electrically isolated from the base allowing common heatsinks and compact designs. The insulating materials used between chip and base is carefully chosen so that the impedance is minimised. The Hirect range extends upto 350 amps and 2200 volts and is available in Diode-Diode, Diode-Thyristor and Thyristor-Thyristor configurations.

The required circuit such as single phase bridges, 3 phase bridges and AC Regulators can be assembled with ease and flexibility using two or more such modules. The modules can be used in almost all applications where stud base or capsules devices were being used in the past.